Semiconductor structure

ABSTRACT

The present disclosure provides a semiconductor structure. The semiconductor structure includes a memory region, the memory region includes a first metal line, a magnetic tunneling junction (MTJ) over the first metal line, a cap. wherein at least a portion of the cap is above the MTJ, a first stop layer above the cap, and a first metal via being disposed over the MTJ and in direct contact with the first stop layer, and a logic region adjacent to the memory region, the logic region includes a second metal line, a third metal line over the second metal line, a second stop layer being disposed over the third metal line, and a second metal via over the third metal line.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a continuation application of prior-tiledU.S. non-provisional application Ser. No. 17/336,024, filed Jun. 1,2021, which claims the benefit of prior-filed U.S. provisionalapplication No. 62/525,610, tiled Jun. 27, 2017, U.S. non-provisionalapplication Ser. No. 15/960,238, filed Apr. 23, 2018, and U.S.non-provisional application No. Sel. 16/998,866, filed Aug. 20, 2020,under 35 U.S.C. 120.

BACKGROUND

Semiconductors are used in integrated circuits for electronicapplications, including radios, televisions, cell phones, and personalcomputing devices. One type of well-known semiconductor device is thesemiconductor storage device, such as dynamic random access memories(DRAMs), or flash memories, both of which use charges to storeinformation.

A more recent development in semiconductor memory devices involves spinelectronics, which combines semiconductor technology and magneticmaterials and devices. The spin polarization of electrons, rather thanthe charge of the electrons, is used to indicate the state of “1” or“0.” One such spin electronic device is a spin torque transfer (STT)magnetic tunneling junction (MTJ) device.

MTJ device includes free layer, tunnel layer, and pinned layer. Themagnetization direction of free layer can be reversed by applying acurrent through tunnel layer, which causes the injected polarizedelectrons within free layer to exert so-called spin torques on themagnetization of free layer. Pinned layer has a fixed magnetizationdirection. When current flows in the direction from free layer to pinnedlayer, electrons flow in a reverse direction, that is, from pinned layerto free layer. The electrons are polarized to the same magnetizationdirection of pinned layer after passing pinned layer; flowing throughtunnel layer; and then into and accumulating in free layer. Eventually,the magnetization of free layer is parallel to that of pinned layer, andMTJ device will be at a low resistance state. The electron injectioncaused by current is referred to as a major injection.

When current flowing from pinned layer to free layer is applied,electrons flow in the direction from free layer to pinned layer. Theelectrons having the same polarization as the magnetization direction ofpinned layer are able to flow through tunnel layer and into pinnedlayer. Conversely, electrons with polarization differing from themagnetization of pinned layer will be reflected (blocked) by pinnedlayer and will accumulate in free layer. Eventually, magnetization offree layer becomes anti-parallel to that of pinned layer, and MIT devicewill be at a high resistance state. The respective electron injectioncaused by current is referred to as a minor injection.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 is a cross section of a semiconductor structure, in accordancewith some embodiments of the present disclosure.

FIG. 2 to FIG. 24 are cross sections of a semiconductor structurefabricated at various stages, in accordance with some embodiments of thepresent disclosure.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may he otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

Notwithstanding that the numerical ranges and parameters setting forththe broad scope of the disclosure are approximations, the numericalvalues set forth in the specific examples are reported as precisely aspossible. Any numerical value, however, inherently contains certainerrors necessarily resulting from the standard deviation found in therespective testing measurements. Also, as used herein, the term “about”generally means within 10%, 5%, 1%, or 0.5% of a given value or range.Alternatively, the term “about” means within an acceptable standarderror of the mean when considered by one of ordinary skill in the art.Other than in the operating/working examples, or unless otherwiseexpressly specified, all of the numerical ranges, amounts, values andpercentages such as those for quantities of materials, durations oftimes, temperatures, operating conditions, ratios of amounts, and thelikes thereof disclosed herein should be understood as modified in allinstances by the term “about.” Accordingly, unless indicated to thecontrary, the numerical parameters set forth in the present disclosureand attached claims are approximations that can vary as desired. At thevery least, each numerical parameter should at least be construed inlight of the number of reported significant digits and by applyingordinary rounding techniques. Ranges can be expressed herein as from oneendpoint to another endpoint or between two endpoints. All rangesdisclosed herein are inclusive of the endpoints, unless specifiedotherwise.

Embedded MRAM cell in a CMOS structure has been continuously developed.A semiconductor circuit with embedded MRAM cell includes an MRAM cellregion and a logic region separated from the MRAM cell region. Forexample, the MRAM cell region may locate at the center of the aforesaidsemiconductor circuit while the logic region may locate at a peripheryof the semiconductor circuit. Note the previous statement is notintended to be limiting. Other arrangement regarding the MRAM cellregion and the logic region are enclosed in the contemplated scope ofthe present disclosure.

In the MRAM cell region, a transistor structure can be disposed underthe MRAM structure. in some embodiments, the MRAM cell is embedded inthe metallization layer prepared in a back-end-of-line (BEOL) operation.For example, the transistor structures in the MRAM cell region and inthe logic region are disposed in a common semiconductor substrate,prepared in a front-end-of-line operation, and are substantiallyidentical in the aforesaid two regions in some embodiments.Conventionally, the VIRAM cell can be embedded in any position of themetallization layer, for example, between adjacent metal line layersdistributed horizontally parallel to a surface of the semiconductorsubstrate. For instance, the embedded MRAM can be located between the4^(th) metal line layer and the 5^(th) metal line layer in an MRAM cellregion. Horizontally shifted to the logic region, the 4^(th) metal linelayer is connected to the 5^(th) metal line layer though a 4^(th) metalvia. In other words, taking the MRAM cell region and the logic regioninto consideration, the embedded MRAM occupies a thickness of at leastthe 4^(th) metal via. The number provided for the metal line layerherein is not limiting. In general, people having ordinary skill in theart can understand that the MRAM is located between an N^(th) metal linelayer and an (N+1)^(th) metal line layer, where N is an integer greaterthan or equal to 1.

The embedded MRAM includes a magnetic tunneling junction (MTJ) composedof ferromagnetic materials. A bottom electrode and a top electrode areelectrically coupled to the MTJ for signal/bias conveyance. Followingthe example previously provided, the bottom electrode is furtherconnected to the N^(th) metal line layer, whereas the top electrode isfurther connected to the (N−1)^(th) metal line layer.

As the CMOS technology node goes down, the thickness of the inter-metaldielectric (IMI)) in the back-end-of-line (BEOL) continues to scale downand become significantly thin in technology node N16 and beyond.However, due to processing barrier, the thickness of the MTJ stackcannot be reduced accordingly. For example, an average thickness of theMTJ stack (including the upper electrode, the lower electrode, and thelayer sandwiched there between) is referred to a first height h. On theother hand, the MD thickness between two adjacent metal line layers isreferred to a second height H. Thickness of the MTJ stack (i.e., h) iskept constant while the IMD thickness (i.e. H) becomes thinner along thescale down of the technology node. Therefore, the room for accommodatingan upper metal over the upper electrode of the MTJ is reduced. Thereduction of upper metal thickness leads to short circuit between theupper metal and the MTJ.

The present disclosure provides a semiconductor structure where a topelectrode cap (hereinafter the “cap”) and a first stop layer disposedover the top electrode of an MTJ in a memory region. The MTJ is disposedover a first N^(th) metal line. The cap is formed over the top electrodein order to prevent the occurrence of short circuit between the uppermetal to the MTJ. In addition, the cap is disposed between the firststop layer and the top electrode of the MIT Moreover, a first (N+1)^(th)metal via is disposed over the MTJ and a bottom portion of which issurrounded by the first stop layer. The first (N+1)^(th) metal via has afirst height. Furthermore, a second stop layer disposed over an(N+1)^(th) metal line in a logic region adjacent to the memory region. Asecond (N+1)^(th) metal via is disposed over the (N+1)^(th) metal lineand has a second height. The first height is greater than the secondheight. In some embodiments, the memory region includes a MRAM cell, aRRAM cell, or a Flash cell.

Deferring to FIG. 1, FIG. 1 is a cross section of a semiconductorstructure 10, in accordance with some embodiments of the presentdisclosure. The semiconductor structure 10 can be a semiconductorcircuit including a MRAM cell region 1.00A and a logic region 100B. Eachof the MRAM cell region 100A and the logic region 100B has a transistorstructure 101 in a semiconductor substrate 100. In some embodiments, thetransistor structures 101 are substantially identical in the MRAM cellregion 100A and in the logic region 100B. In some embodiments, thesemiconductor substrate 100 may be but is not limited to, for example,a. silicon substrate. In an embodiment, substrate 100 is a semiconductorsubstrate, such as a silicon substrate, although it may include othersemiconductor materials, such as silicon germanium, silicon carbide,gallium arsenide, or the like, In the present embodiment, thesemiconductor substrate 100 is a p-type semiconductor substrate(P-Substrate) or a n-type semiconductor substrate (N-Substrate)comprising silicon. Alternatively, the substrate 100 includes anotherelementary semiconductor, such as germanium; a compound semiconductorincluding silicon carbide, gallium arsenic, gallium phosphide, indiumphosphide, indium arsenide, and/or indium antimonids; an alloysemiconductor including SiGe, GaAsP,AlInAs, AIGaAs, GaInAs, GaInp,and/or GaInAsP; or combinations thereof. In yet another alternative, thesemiconductor substrate 100 is a semiconductor on insulator (SOI). Inother alternatives, semiconductor substrate 100 may include a doped epilayer, a gradient semiconductor layer, and/or a semiconductor layeroverlying another semiconductor layer of a different type, such as asilicon layer on a silicon germanium layer. The semiconductor substrate100 may or may not include doped regions, such as a p-well, an n-well,or combination thereof.

The semiconductor substrate 100 further includes heavily doped regionssuch as sources 103 and drains 105 at least partially in thesemiconductor substrate 100. A gate 107 is positioned over a top surfaceof the semiconductor substrate 100 and between the source 103 and thedrain 107, Contact plugs 108 are formed in inter-layer dielectric (LD)109, and may be electrically coupled to the transistor structure 101. Insome embodiments, the ILL) 109 is formed on the semiconductor substrate100. The ILD 109 may be formed by a variety of techniques for formingsuch layers, e.g., chemical vapor deposition (CVD), low-pressure CVD(LPCVI)), plasma-enhanced. CVD (PECVD), sputtering and physical vapordeposition (PVD), thermal growing, and the like. The ILD 109 above thesemiconductor substrate 100 may be formed from a variety of dielectricmaterials and may, for example, be an oxide (e.g., Ge oxide), anoxynitride (e.g., GaP oxynitride), silicon dioxide (SiO₂), anitrogen-bearing oxide (e.g.. nitrogen-bearing SiO2), a nitrogen-dopedoxide (e.g., N?-implanted SiO₂), silicon oxynitride (Si_(x)O_(y)N_(z)),and the like.

FIG. 1 shows a planar transistor having a doped region in thesemiconductor substrate 100. However, the present disclosure is notlimited thereto. Any non-planar transistor, such as a FinFET structure,can have raised doped regions.

In some embodiments, a shallow trench isolation (STI) 111 is provided todefine and electrically isolate adjacent transistors. A number of STI111 are formed in the semiconductor substrate 100. The STI 111, whichmay be formed of suitable dielectric materials, may be provided toisolate a transistor electrically from neighboring semiconductor devicessuch as other transistors. The STI 111 may, for example, include anoxide (e.g., Ge oxide), an oxynitride (e.g., GaP oxynitride), silicondioxide (SiO₂), a nitrogen-bearing oxide (e.g., nitrogen-bearing SiO₂),a nitrogen-doped oxide (e.g., N₂-implanted SiO₂), silicon oxynitride(Si_(x)O_(y)N_(z)nd the like. The STI 111 may also be formed of anysuitable “high dielectric constant” or “high K” material, where K isgreater than or equal to about 8, such as titanium oxide (Ti_(x)O_(y),e.g., TiO₂), tantalum oxide (Ta_(x)O_(y), e.g., Ta₂O₅), barium strontiumtitanate (BST, BaTiO₃/SrTiO₃), and the like. Alternatively, the STI 111may also be formed of any suitable “low dielectric constant” or “low K”dielectric material, where K is less than or equal to about 4.

Deferring to FIG. 1, a. metallization structure 101′ is disposed abovethe transistor structure 101. Because the N^(th) metal line 121A′ of theN^(th) metal layer 121 may not be the first metal layer over thetransistor structure 101, the omission of a portion of the metallizationstructure 101′ is represented by dots. In the MRAM cell region 100A, anMTJ structure 130 is disposed between an N^(th) metal line 121A′ of theN^(th) metal layer 121 and an (N+1)^(th) metal via 124A of the(N+1)^(th) metal layer 123, whereas in the logic region 100B, the N^(th)metal line 121B′ is connected to the (N+1)^(th) metal via 124B by anN^(th) metal via 122 of the N^(th) metal layer 121 and an (N+1)^(th)metal line 123′ of the (N+1)^(th) metal layer 123. In some embodiments,the metal lines and metal vias are filled with electrically conductivematerial, e.g. copper, gold or another suitable metal or alloy, to forma number of conductive vias. Metal lines and metal vias in differentmetal layers form an interconnect structure composed of substantiallypure copper (for example, with a weight percentage of copper beinggreater than about 90 percent, or greater than about 95 percent) orcopper alloys, and may be formed using the single and/or dual damasceneprocesses. Metal lines and metal vias may be, or may not be,substantially free from aluminum, Interconnect structure includes aplurality of metal layers, namely M₁, M₂ . . . M_(N). Throughout thedescription, the term “metal layer” refers to the collection of themetal lines in the same layer. Metal layers M₁ through M_(N) are formedin inter-metal dielectrics (IMDs) 127, which may be formed of oxidessuch as un-doped Silicate Glass (USG), Fluorinated. Silicate Glass(FSG), low-k dielectric materials, or the like. The low-k dielectricmaterials may have k values lower than 3.8, although the dielectricmaterials of IMDs 127 may also be close to 3.8. In some embodiments, thek values of the low-k dielectric materials are lower than about 3.0, andmay be lower than about 2.5. The N^(th) metal via 122 and the (N+1)^(th)metal line 123′ may be formed by a variety of techniques, e.g,,electroplating, electroless plating, high-density ionized metal plasma(IMP) deposition, high-density inductively coupled plasma (ICP)deposition, sputtering, physical vapor deposition (PVD), chemical vapordeposition (CAI)), low-pressure chemical vapor deposition (LPCVD),plasma-enhanced chemical vapor deposition (PECVD), and the like.

Referring to the MRAM cell region 100A of the semiconductor structure10, the MTJ structure 130 at least includes a bottom electrode 131, atop electrode 133, and an MTJ 135. In some embodiments, the bottomelectrode 131 possesses a trapezoidal recess in a composite layerincluding SiC 141 and tetraethyl orthosilicate (TEOS) 142.Alternatively, the TEOS 142 can be replaced or combined withsilicon-rich oxides (SRO). in some embodiments, the bottom electrode 131may include metal nitrides. In some embodiments, the top electrode 133may include metal nitrides. Materials constituting the bottom electrode131 and the top electrode 133 may or may not be identical. In someembodiments, the bottom electrode may compose more than one material andform a material stack. In some embodiments, the bottom electrodeincludes TaN, W Al, Ni, Co, Cu, or combinations thereof. As shown inFIG. 1, the bottom electrode 131 is electrically coupling to the firstN^(th) metal line 121A′.

In some embodiments as shown in the MRAM cell region 100 A of FIG. 1, acap 150 is on the top electrode 133. The cap 150 can be composed of Ti,Ta, TiN, TaN, W, Ru or combinations thereof. In some embodiments, thecap 150 is formed on the top electrode 133 in order to prevent theoccurrence of short circuit between the upper metal, that is, the(N+1)^(th) metal via 124A, and the MTJ 135. In some embodiments, aplanarization operation, such as a CMP operation, may be applied to atop surface of the cap 150. In some embodiments, the material of the cap150 is different from that of the top electrode 133. In someembodiments, the thickness of the cap 150 is in a range of from about 5nm to about 30 nm.

In some embodiments, the cap 150 possesses a width D1. In someembodiments, a top surface of the MTJ 135 possesses a width D2 and abottom surface of the MTJ 135 possesses a width D3. In some embodiments,a ratio of a width D1 of the cap 150 and a width D3 of the bottomsurface of the MTJ 135 is in a range of from about 1.2 to about 2, insome embodiments, a ratio of a width D2 of the top surface of the MTJ135 and the width D3 of the bottom surface of the MTJ 135 is in a rangefrom about 0.6 to about 0.96. In some embodiments, the width D1 isgreater than the width D2 and in a specific ratio range in order toeffectively prevent the short circuit between the (N+1)^(th) metal via124A and the MTJ 135.

In some embodiments, referring to FIG. 1, a spacer 128 laterallysurrounds the MTJ structure 130 from side walls thereof and forms ahollow cylinder feature viewing from a top view perspective (not shown).In some embodiments, the spacer 128 possesses a thickness D4. In someembodiments, a ratio of a thickness D4 of the spacer 128 and the widthD3 of the bottom surface of the MU 135 is in a range of from about 0.1to about 0.6. Thus, the width D1 can provide a wider process window forthe (N+1)^(th) metal via 124A landing and prevent the (N+1)^(th) metalvia 124A from shifting problem. In some embodiments, the spacer 128 canbe composed of SiC, SiN, SiON, SiOC or combinations thereof. In someembodiments, the spacer 128 may be formed by a variety of techniques,e.g., CVD, PVD or an atomic layer deposition (ALD) operation.

In some embodiments as shown in the MRAM cell region 100A of FIG. 1, the(N+1)^(th) metal via 124A is partially surrounded by a first stop layer151 and a cap 150 in addition to being surrounded by the IMDs 127. Insome embodiments, the first stop layer 151 can be disposed over the cap150, and surrounding the (N+1)^(th) metal via 124A. In some embodiments,the cap 150 is positioned between the first stop layer 151 and the topelectrode 133. In some embodiments, the first stop layer 151 can becomposed of SiC, SiN, SiOC, SiON or combinations thereof. In someembodiments, the (N+1)^(th) metal via 124A has a first height T1. Asshown in FIG. 1, a sidewall of the MTJ 135 is protected by the spacer128 such as a nitride layer. In some embodiments, the spacer 128includes silicon nitrides. In some embodiments, a dielectric layer 129can be disposed over the spacer 128.

In some embodiments as shown in the logic region 100B of FIG. 1, the(N+1)^(th) metal via 124B in the logic region 100B is partiallysurrounded by a second stop layer 152 in addition to being surrounded bythe IMDs 127 and the (N+1)^(th) metal line 123′ in the logic region 100Bis surrounded by the IMDs 127 only. In some embodiments, the second stoplayer 152 can be disposed over the (N+1)^(th) metal line 123′, andsurrounding the (N+1)^(th) metal via 124B. In some embodiments, thesecond stop layer 152 can be composed of SiC, SiN, SiOC, SiON orcombinations thereof. In some embodiments, the (N+1)^(th) metal via 124Bhas a. second height T2. In some embodiments, the stop layers, forexample the first stop layer 151 and the second stop layer 152, areresistant to the etchant during an etch operation removing dielectriclayer 127. The etch operation is stopped at the top surfaces of the stoplayers. In some embodiments, the etch operation in the presentembodiment includes reactive ion etch (RIE) adopting fluorine-containinggases. The etch operation is conducted using a suitable etchant, such asfluorine-containing gases or CF₄, CHF₃, CH₂F₂, Ar, N₂, O₂ and He.

Comparing the MRAM cell region 100A and the logic region 100B, the firstheight T1 of the (N+1)^(th) metal via 124A is greater than the secondheight T2 of the (N+1)^(th) metal via 124B. In some embodiments, the(N+1)^(th) metal via 124A and the (N+1)^(th) metal via 124B are formedat the same operation, for example, a single dual Damascene operationover the MRAM cell region 100A and the logic region 100B. In someembodiments, the first stop layer 151 and the second stop layer 152 arenon-coplanar or not at the same elevation level. In some embodiments, abottom surface of the second stop layer 152 is higher than a top surfaceof the first stop layer 151 by a vertical difference VD, In someembodiments, referring to FIG. 1. the first height T1 is greater thanthe second height T2, in addition, the first stop layer 151 in the MRAMcell region 100A and the second stop layer 152 in the logic region 100Bare formed at different operations. For example, the first stop layer151 in the MRAM cell region 100A is formed prior to the second stoplayer 152 is formed in the logic region 100B. Therefore, the second stoplayer 152 in the logic region 10013 and the first stop layer 151 in theMRAM cell region 100A are not at the same elevation level. In someembodiments, a removal operation of the first stop layer 151 originallyformed at the logic region 1.00B and a removal operation of the secondstop layer 152 originally formed at the MRAM cell region 100A may beconducted during the manufacturing of the semiconductor structure 10. Insome embodiments, a thickness of the MTJ structure 130 (including theupper electrode 133, the lower electrode 131B, and the MTJ layer 135) isreferred to a third height T3. In some embodiments, a distance measuredfrom the second stop layer 152 to the barrier layer 140 is referred to aheight T4. In some embodiments, a ratio of the thickness T3 of the MTJstructure 130 and the height T4 is in a range of from about 0.3 to about0.75. In some embodiments, a ratio of the vertical difference VD and thethickness T3 is in a range from about 0.2 to about 2.

In some embodiments, the bottom electrode 131 of the MTJ structure 130is electrically coupled with the doped region. In some embodiments, thedoped region is a drain 105 or a source 103. In other embodiments, thebottom electrode 131 of the MTJ structure 130 is electrically coupledwith the gate 107. In some embodiments, the gate 107 of thesemiconductor structure 10 can be a polysilicon gate or a metal gate.

FIG. 2. to FIG. 24 are cross sections of a CMOS structure fabricated atvarious stages, in accordance with some embodiments of the presentdisclosure. In FIG. 2, a semiconductor structure having a predeterminedMRAM cell region 100A and a logic region 100B is provided. In someembodiments, a transistor structure is pre-formed in a semiconductorsubstrate (not shown in FIG. 2). The integrated circuit device mayundergo further CMOS or MOS technology processing to form variousfeatures known in the art. For example, one or more contact plugs, suchas silicide regions, may also be formed. The contact features may becoupled to the source and drain. The contact features comprise silicidematerials, such as nickel silicide (NiSi), nickel-platinum silicide(NiPtSi), nickel-platinum-germanium silicide (NiPtGeSi),nickel-germanium silicide (NiGeSi), ytterbium silicide (YbSi), platinumsilicide (PtSi), iridium silicide (IrSi), erbium silicide ErSi), cobaltsilicide (CoSi), other suitable conductive materials, and/orcombinations thereof. In an example, the contact features are formed bya salicide (self-aligned silicide) process.

A first N^(th) metal line 121A′ is patterned in a dielectric layer 127over the transistor structure in the MRAM cell region 100A. A secondN^(th) metal line 121B′ is patterned in a dielectric layer 127 over thetransistor structure in the logic region 100B. The first and the secondN^(th) metal lines 121A′ and 121B′ (collectively the “N^(th) metalline”) are formed concurrently through a single patterning operation. Insome embodiments, the N^(th) metal line can be formed of anelectroplating operation with a Cu seed layer deposited over thepatterned dielectric layer 127. In other embodiments, the N^(th) metalline may be formed by a variety of techniques, e.g., electrolessplating, high-density ionized metal plasma (IMP) deposition,high-density inductively coupled plasma (ICP) deposition, sputtering,physical vapor deposition (PVD), chemical vapor deposition (CVD),low-pressure chemical vapor deposition (LPCVD), plasma-enhanced chemicalvapor deposition (PECVD), and the like. A planarization operation isperformed to expose a top surface of the N^(th) metal line and the topsurface of the dielectric layer 127.

In FIG, 3, a barrier layer 140 in a form of a stacking layer including aSiC layer 141 and a TEOS/SRO layer 142 are blanket deposited over a topsurface of the N^(th) metal line and a top surface of the dielectriclayer 127, in both the MRAM cell region 100A and the logic region 100B.The barrier layer 140 can be formed by a variety of techniques, e.g.,chemical vapor deposition (CVD), low-pressure CVD (LPCVD),plasma-enhanced CVD (PECVD), sputtering and physical vapor deposition(PVD), thermal growing, and the like. In FIG. 4, a photoresist layer(not shown) is patterned over the stacking layer to expose a bottomelectrode region of the MTJ structure. As shown in FIG. 4, a bottomelectrode via hole 131′ is formed in the barrier layer 140 by a suitabledry etch operation. In some embodiments, the dry etch in the presentoperation includes reactive ion etch (RIE) adopting fluorine-containinggases. In some embodiments, the present dry etch operation can be anysuitable dielectric etch to form via trenches in a metallizationstructure of conventional CMOS technology. Referring to the logic region100B as shown in FIG. 4, the barrier layer 140 is protected by thephotoresist layer (not shown) such that a top surface of the secondN^(th) metal line 121B′ is not exposed as opposed to the counterpart inthe MRAM cell region 100A.

In FIG, 5, a diffusion barrier layer 161 is blanket lined over thebottom electrode via hole 131′ in the MRAM cell region 100A. and overthe barrier layer 140 in the logic region 100.B. Subsequently, a firstdeposition of bottom electrode material 131A is conducted to be disposedover the diffusion barrier layer 161 and the barrier layer 140. Thefirst deposited bottom electrode material 131A is then etched back tolevel with a top surface of the barrier layer 140, as illustrated inFIG. 6. In FIG. 7, a second deposition of bottom electrode material 131Bis blanket formed over the first deposited bottom electrode material131A and the barrier layer 140. The second deposited bottom electrodematerial 131B is then thinned to a predetermined thickness, asillustrated in FIG. 8.

FIG. 9 shows the top electrode formation of an MTJ structure. In FIG. 9,an MTJ 135 is deposited in a form of multiple material stacks over thebottom electrode 131B. In some embodiments, the MTJ 135 is having athickness of from about 150 A to about 300 Å. The MTJ 135 may be formedby variety of techniques, e.g., high-density ionized metal plasma (IMP)deposition, high-density inductively coupled plasma (ICP) deposition,sputtering, physical vapor deposition (PVD), chemical vapor deposition(CVD), low-pressure chemical vapor deposition (LPCVD), plasma.-enhancedchemical vapor deposition (PECVD), and the like. In some embodiments,the MTJ 135 may include ferromagnetic layers, spacers, and a cappinglayer. The capping layer is formed on the ferromagnetic layer. Each ofthe ferromagnetic layers may include ferromagnetic material, which maybe metal or metal alloy, for example, Fe, Co, Ni, CoFeB, FeB, CoFe,FePt, FePd, CoPt, CoPd, CoNi, ThFeCo, CrNi or the like. The spacer mayinclude non-ferromagnetic metal, for example, Ag, Au, Cu, Ta, W, Mn, Pt,Pd, V, Cr, Nb, Mo, Tc, Ru or the like. Another spacer may also includeinsulator, for example, Al₂O₃, MgO, TaO, RuO or the like. The cappinglayer may include non-ferromagnetic material, which may be a metal or aninsulator, for example, Ag, Au, Cu, Ta, W, Mn, Pt, Pd, V, Cr, Nb, Mo,Tc, Ru, Ir, Re, Os, Al₂O₃, MgO, TaO, RuO or the like. The capping layermay reduce write current of its associated MRAM cell. The ferromagneticlayer may function as a free layer whose magnetic polarity or magneticorientation can be changed during write operation of its associated MRAMcell. The ferromagnetic layers and the spacer may function as a fixed orpinned layer whose magnetic orientation may not be changed duringoperation of its associated MRAM cell. It is contemplated that the MTJ135 may include an antiferromagnetic layer in accordance with otherembodiments. Following the formation of the MTJ 135, a top electrodelayer 133 is deposited over the MTJ 135. The top electrode layer 133 maybe formed by a variety of techniques, e.g., high-density ionized metalplasma (IMP) deposition, high-density inductively coupled plasma (ICP)deposition, sputtering, physical vapor deposition (PVD), chemical vapordeposition (CVD), low-pressure chemical vapor deposition (LPCVD),plasma-enhanced chemical vapor deposition (PECVD), and the like.

Referring to FIG. 10, the bottom electrode 131A and 131B is formed by aself-aligned manner. For example, a patterned photoresist (not shown)layer is formed over the top electrode 133 in FIG. 9 and an etchingoperation is carried out to pattern the MTJ structure 130. In turns, thebottom electrode 131A and 131B is formed aligning to the overlying MTJ135 and the top electrode 133. To elaborate, a mask layer (not shown)exposing a desired MTJ pattern is formed over the top electrode layer133 for the ensuing MTJ structure formation. The mask layer possessingthe desired MTJ pattern in the MRAM cell region 100A and may have amulti-layer structure, which may include, for example, an oxide layer,an advanced patterning film (APF) layer and an oxide layer. Each of theoxide layer, the APF layer, and the oxide layer may be formed by avariety of techniques, e.g., high-density ionized metal plasma (IMP)deposition, high-density inductively coupled plasma (ICP) deposition,sputtering, physical vapor deposition (PVD), chemical vapor deposition(CVD), low-pressure chemical vapor deposition (LPCVD), plasma-enhancedchemical vapor deposition (PECVD), and the like. In some embodiments,the mask layer is configured to pattern the MTJ 135, the top electrode133, and the second deposited bottom electrode 131B. For example, awidth of the masking region is determined according to the desired MTJdiameter, In sonic embodiments, the MTJ 135 and the top electrode 133are formed by an RIE, to have a trapezoidal shape viewing from a crosssection.

In FIG. 11, a spacer 128 is conformally formed over the bottom electrode131, the MTJ 135, and the top electrode 133. In some embodiments, thespacer 128 possesses a thickness D4. Note a sidewall of the MTJ 135 andthe sidewall of the second deposited bottom electrode 131B aresurrounded by the spacer 128 to prevent oxidation or othercontamination. Subsequently, a dielectric layer 129 such as a TEOS layeror an inter metal dielectric (IMI)) layer is conformally deposited overthe spacer 128. In some embodiments, a ratio of the thickness D4 to awidth of the bottom surface of the MD 135 is in a range of from about0.1 to about 0.6 to achieve optimal oxidation and contaminationprevention.

In FIG. 12, a planarization operation is performed on the dielectriclayer 129 such that the top surface of the dielectric layer 129 issubstantially flat across the MRAM cell region 100A and the logic region100B. As shown in FIG. 12, the top surface of the top electrode 133 isexposed from the dielectric layer 129 after an etch back operation. Insome embodiments, etch back operation includes a chemical mechanicalpolishing (CAP).

In FIG. 13A, a deposition of a cap 150 is blanket formed over the topsurface of the top electrode 133 and the barrier layer 140 in the MRAMcell region 100A and over the top surface of the dielectric layer 129 inthe logic region 100B. The deposited cap 150 can be composed of Ti, TiN,TaN, W, Ru or combinations thereof. In some embodiments, the cap 150 canbe deposited to a predetermined thickness by a variety of techniques,e.g., CVD, PVD or ALD operation. Alternatively, the cap 150 can bedeposited to a first thickness by a chemical vapor deposition (CVD)operation and then be thinned by a CMP operation to a predeterminedthickness. In some embodiments, the predetermined thickness of the cap150 is in a range from about 5 nm to about 30 nm. As shown in FIG. 13A,a deposition of a first stop layer 151 is blanket formed over the cap150 in the MRAM cell region 100A and the cap 150 in the logic region100B. The deposited first stop layer 151 can be composed of SiC, SiN,SiOC, SiON or combinations thereof. In some embodiments, the first stoplayer 151 can be deposited by CVD or ALD operation. In some embodiments,the predetermined thickness is in a range of from about 5 nm to about 40nm.

In FIG. 13B, the cap 150 and the first stop layer 151 at the logicregion 100B is removed through lithography operations. Meanwhile, thecap 150 and the first stop layer 151 at the MRAM cell region 100A ispatterned to form a localized cap 150 and first stop layer 151 coveringthe MTJ structure 130. In some embodiments, the cap 150 and the firststop layer 151 over one MTJ structure 130 is electrically isolated fromthe cap 150 and the first stop layer 151 over another adjacent MTJstructure 130,

Following FIG. 13B, in some embodiments, the critical dimensions (CD) ofthe cap 150 and the MTJ 135 are determined to be in a range so thatallowing the cap 150 to provide optimal protection to the underlying MTJ135 memory structure. For example, the width of the cap 150 shall be atleast greater than the maximum width of the NW 135. Moreover, in someembodiments, the width of the cap 150 shall be at least greater than themaximum width of the MD 135 plus the spacer 128 laterally surroundingthe MTJ 135. In some embodiments, the cap 150 possesses a width D1, atop surface of the MTJ 135 possesses a width D2 and a bottom surface ofthe MTJ 135 possesses a width D3. In some embodiments, a ratio of awidth D1 of the cap 150 and a width D3 of the bottom surface of the MU135 is in a range of from about 1.2 to about 2. In some embodiments, aratio of a width D2 of the top surface of the MD 135 and the width D3 ofthe bottom surface of the MTJ 135 is in a range of from about 0.6 toabout 0.96. In some embodiments, the stop layers, for example the firststop layer 151, is resistant to the etchant during an etch operation toremove dielectric layer subsequently formed. The etch operation isstopped at the top surfaces of the stop layers. In some embodiments, theetch operation in the present embodiment includes reactive ion etch(RIE) adopting fluorine-containing gases. The etch operation isconducted using a suitable etchant, such as CF₄, CHF₃, CH₂F₂, Ar, N₂, O₂and He.

As shown in FIG, 14, the dielectric layer 129, the spacer 128, and thebarrier layer 140 are removed by a suitable dry etch operation in thelogic region 100B. Referring to the logic region 100B as shown in FIG.14, the cap 150 and the first stop layer 151 in the MRAM cell region100A is protected by the photoresist layer (not shown) such that a topsurface of the first stop layer 151 is not exposed as opposed to thecounterpart in the logic region 100B. In FIG. 14, an upper portion ofthe barrier layer 140, the spacer 128, the dielectric layer 129, the cap150, and the first stop layer 151 are removed from the logic region 100Bthrough an etch back operation, as illustrated in FIG, 14. Hence, theMRAM cell region 100A is in greater height than the logic region 100B InFIG. 15, a low-k dielectric layer 127 is formed to cover the MRAM cellregion 100A and the logic region 100B. In some embodiments, asubstantially coplanar surface of the low-k dielectric layer 127 isformed over the MRAM cell region 100A and the logic region 100B. An etchback operation is performed to obtain a substantially flat top surfaceof the low-k dielectric layer 127 for the following trench formation inthe logic region 100B.

As shown in FIG. 16, a photoresist layer ISO is patterned over the MRAMcell region 100A and exposing the logic region 100B. Conventionally, themetal trench formation is conducted both in the MRAM cell region 100Aand the logic region 100B, such that, for example, an N^(th) metal viatrench is formed in the low-k dielectric layer 127 of the logic region100B, and an (N+1)^(th) metal line trench is formed in the low-kdielectric layer 127 of the logic region 1008. However, in the presentdisclosure, both the N^(th) metal via trench and the (N+1)^(th) metalline trench are formed in the logic region 100B only, as would bediscussed in FIG. 17.

Referring to FIG. 17, no metal trench is formed over the MTJ structure130, and thus the top surface of the top electrode 133 of the MTJstructure 130 is not exposed and covered by the cap 150 and the firststop layer 151. In the logic region 100B, an N^(th) metal via trench andan (N+1)^(th) metal line trench (combinatory 12313) are formed over thesecond N^(th) metal line 121B′, exposing a top surface of the secondN^(th) metal line 121B′.

In FIG. 18 and FIG. 19, in the logic region 100 B, conductive metalfills the metal line trench/metal via trench (hereinafter “trenches”)through, for example, a conventional Dual Damascene operation. Thepatterned trenches are filled with a conductive material by anelectroplating operation, and excess portions of the conductive materialare removed from the surface using a chemical mechanical polishing (CMP)operation, an etch operation, or combinations thereof. Details ofelectroplating the trenches are provided below. N^(th) metal via 122 and(N+M)^(th) metal line 123′ may be formed from W, and more preferablyfrom copper (Cu), including AlCu (collectively, Cu). In one embodiment,(N+1)^(th) metal lines 123′ are formed using the Damascene operation,which should be familiar to those in the art. First, trenches are etchedthrough the low k dielectric layer. This process can be performed byplasma etch operation, such as an Inductively Coupled Plasma (ICP) etch.A dielectric liner (not shown) then may be deposited on the trenchessidewalls. In embodiments, the liner materials may include silicon oxide(SiO_(x)) or silicon nitride (SiN_(x)) which may be formed by plasmadeposition process, such as physical vapor deposition (PVD) or chemicalvapor deposition (CVD) including plasma enhanced chemical vapordeposition (PECVD).

After the planarization operation removing the overburden of theconductive metal as illustrated in FIG. 19, an (N÷1)^(th) metal line123′ in the logic region 100B, as well as an N^(th) metal via 122 in thelogic region 100B, are formed. Note at the present operation, no metallines are formed over the first stop layer 151 and the cap 150 over thetop electrode 133 of the MTJ structure 130 since the MTJ structure 130occupies the corresponding elevation level of the N^(th) metal via 122and the (N+M)^(th) metal line 123′ in the logic region 100B.

In FIG. 20, note in the MRAM cell region 100A, the cap 150 is in contactwith a top surface of the top electrode 133 of the MTJ structure 130 atcurrent operation. As shown in FIG. 20, a deposition of a second stoplayer 152 is blanket formed over the first stop layer 151 and the low-kdielectric layer 127 in the MRAM cell region 100A and (N+1)^(th) metalline 123′ in the logic region 100. Note the second stop layer 152 is indirect contact with a top surface of the (N+1)^(th) metal line 123′ butnot in direct contact with the first stop player 151. The depositedsecond stop layer 152 may be composed of SiC, SiN, SiOC, SiON orcombinations thereof. In some embodiments, the second stop layer 152 canbe deposited by CVD or ALD operation. In some embodiments, thepredetermined thickness of the second stop layer 152 is in a range offrom about 5 nm to about 40 nm. Therefore, as shown in FIG. 20, thefirst stop layer 151 is non-coplanar with the second stop layer 152. Asshown in FIG. 21, the second stop layer 152 is removed from the MRAMcell region 100A through an etch back operation.

As shown in FIG. 22, a low-k dielectric layer 127′ is formed toconformally cover the MRAM cell region 100A and the logic region 100B.In FIG. 23, the (N+1)^(th) metal via hole as well as (N+2)^(th) metalline trench in both the MRAM cell region 100A and the logic region 100B(combinatorily 125A in the MRAM cell region 100A and 125B in the logicregion 100B) are formed in the low k dielectric layer 127. Note the(N+1)^(th)metal via hole and (N+2)^(th) metal line trench in the MRAMcell region 100A penetrates through the low k dielectric layer 127 and127′, the first stop layer 151, and stop at the cap 150. Therefore, thetop surface of the top electrode 133 is not exposed in the MRAM cellregion 100A after the formation of the via hole and the line trench. The(N+1)^(th) metal via hole and (N+2)^(th) metal line trench in the logicregion 100B penetrates through the low k dielectric layer 127′ and thesecond stop layer 152, exposing the top surface of the (N+1)^(th) metalline 123′. In FIG. 24, the (N+1)^(th) metal via hole as well as(N+2)^(th) metal line trench are filled with conductive materials aspreviously described. In some embodiments, the manufacturing operationsin both the MRAM cell region 100A and the logic region 100B aresubstantially identical after the formation of the (N+1)^(th) metal line123′. The (N+1)^(th) metal vias 124A, 124B and the (N+2)^(th) metallines 125A′ and 125B″ are formed in the RAM cell region 100A and thelogic region 100B, respectively, in a single Damascene operation.

Subsequent processing may further include forming variouscontacts/vias/lines and multilayer interconnect features (e.g., metallayers and interlayer dielectrics) over the substrate, configured toconnect the various features or structures of the integrated circuitdevice. The additional features may provide electrical interconnectionto the device including the formed. metal gate structures, For example,a multilayer interconnection includes vertical interconnects, such asconventional vias or contacts, and horizontal interconnects, such asmetal lines. The various interconnection features may implement variousconductive materials including copper, tungsten, and/or silicide. In oneexample, a damascene and/or dual damascene process is used to form acopper related multilayer interconnection structure.

Some embodiments of the present disclosure provide a semiconductorstructure, including a memory region and a logic region adjacent to thememory region. The memory region includes a first N^(th) metal line, afirst stop layer being disposed over a magnetic tunneling junction (MEI)over the first N^(th) metal line, and a. first (N+1)^(th) metal viabeing disposed over the NW and surrounded by the first stop layer, thefirst (N+1)^(th) metal via having a first height. The logic regionincludes a second N^(th) metal line, a second stop layer being disposedover an (N+1)^(th) metal line, and a second (N+1)^(th) metal via overthe (N+1)^(th) metal line and having a second height. N is an integergreater than or equal to 1 and the first height is greater than thesecond height.

Some embodiments of the present disclosure provide a semiconductorstructure, including a memory region and a logic region adjacent to thememory region. The memory region includes a first N^(th) metal line, afirst stop layer being disposed over a top electrode of a magnetictunneling junction (MTJ) over the first N^(th) metal line, a first(N+1)^(th) metal via over the MTJ and surrounded by the first stop layerand a cap positioned between the first stop layer and the top electrode.The logic region includes a second N^(th) metal line, a second stoplayer disposed over an (N+1)^(th) metal line and a second (N+1)^(th)metal via over the (N+1)^(th) metal line. N is an integer greater thanor equal to 1 and the first stop layer is non-coplanar with the secondstop layer.

Some embodiments of the present disclosure provide a method formanufacturing a semiconductor structure. The method includes (1) forminga magnetic tunneling junction (MTJ) over a first N^(th) metal line in amemory region, (2) forming a top electrode over the MTJ, (3) forming afirst stop layer over the top electrode in the memory region, (4)forming an (N+1)^(th) metal line (123′) over a second N^(th) metal line(121B′) in a logic region, (5) forming a second stop layer over the(N+1)^(th) metal line in a logic region, and (6) forming a first(N+1)^(th) metal via over the top electrode and a second (N+1)^(th)metal via over the (N+1)^(th) metal line concurrently. N is an integergreater than or equal to 1.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

Moreover, the scope of the present application is not intended to belimited to the particular embodiments of the process, machine,manufacture, composition of matter, means, methods and steps describedin the specification. As one of ordinary skill in the art will readilyappreciate from the disclosure of the present invention, processes,machines, manufacture, compositions of matter, means, methods, or steps,presently existing or later to be developed, that perform substantiallythe same function or achieve substantially the same result as thecorresponding embodiments described herein may be utilized according tothe present invention. Accordingly, the appended claims are intended toinclude within their scope such processes, machines, manufacture,compositions of matter, means, methods, or steps.

What is claimed is:
 1. A semiconductor structure, comprising: a memoryregion, the memory region comprises: a first metal line; a magnetictunneling junction (MTJ) over the first metal line; a cap, wherein atleast a portion of the cap is above the MTJ; a first stop layer abovethe cap; and a first metal via being disposed over the MTJ and in directcontact with the first stop layer; and a logic region adjacent to thememory region, the logic region comprises: a second metal line; a thirdmetal line over the second metal line; a second stop layer beingdisposed over the third metal line; and a second metal via over thethird metal line.
 2. The semiconductor structure of claim 1, wherein abottom surface of the second stop layer is above the top surface of thefirst etch stop layer.
 3. The semiconductor structure of claim 1,wherein the first stop layer is in direct contact with the cap.
 4. Thesemiconductor structure of claim 1, wherein the cap comprises anitride-based material.
 5. The semiconductor structure of claim 1,wherein a thickness of a portion of the cap is in a range from 5 nm to30 nm.
 6. The semiconductor structure of claim 1, wherein a bottom ofthe first metal via is below a bottom of the second metal via.
 7. Thesemiconductor structure of claim 1, wherein a bottom surface of thesecond stop layer is above the cap.
 8. The semiconductor structure ofclaim 1, wherein a total height of the first metal via is greater than atotal height of the second metal via.
 9. The semiconductor structure ofclaim 1, wherein a total width of the cap is greater than a total widthof a bottom surface of the MTJ.
 10. A semiconductor structure,comprising: a memory region, the memory region comprises: a first metalline; a magnetic tunneling junction (MTJ) over the first metal line; aspacer at least partially surrounding the MTJ in lateral direction;protective layer, wherein at least a portion of the protective layer isabove the MTJ; and a first metal via over the MTJ, wherein theprotective layer is in direct contact with the spacer and the firstmetal via ; and a logic region adjacent to the memory region, the logicregion comprises: a second metal line; a third metal line over thesecond metal line; and a second metal via over the third metal line. 11.The semiconductor structure of claim 10, wherein at least a portion ofthe spacer is below a top surface of the protective layer.
 12. Thesemiconductor structure of claim 10, wherein a total height of the firstmetal via is greater than a total height of the second metal via. 13.The semiconductor structure of claim 10, wherein a bottom surface of thefirst metal via is free from being aligned with a top surface of thespacer.
 14. A semiconductor structure, comprising: a memory region, thememory region comprises: a first metal line; a magnetic tunnelingjunction (MTJ) over the first metal line; a cap, wherein at least aportion of the cap is above the MTJ; a first stop layer over the cap;and a first metal via over the MTJ, wherein a bottom surface of thefirst metal via is below a top surface of the cap; and a logic regionadjacent to the memory region, the logic region comprises: a secondmetal line; a third metal line over the second metal line; and a secondmetal via over the third metal line.
 15. The semiconductor structure ofclaim 14, wherein at least a portion of a sidewall of the first metalvia is in direct contact with the cap.
 16. The semiconductor structureof claim 14, wherein a top surface of the third metal line is above thebottom surface of the first metal via.
 17. The semiconductor structureof claim 14, further comprising a top electrode above the MTJ.
 18. Thesemiconductor structure of claim 17, wherein the top electrode is indirect contact with the cap.
 19. The semiconductor structure of claim17, wherein a portion of a top surface of the top electrode is in directcontact with the cap.
 20. The semiconductor structure of claim 14,wherein the bottom surface of the first metal via is below a bottom ofthe second metal via.